Grounding and bonding is integral t

Grounding and bonding is integral to the proper performance of both electrical and telecommunications systems.

ANSI/TIA-607-B Generic “Telecommunications Bonding and Grounding (Earthing) for Customer Premises” was developed by the TIA TR-42.16 Grounding and Bonding Subcommittee and published in August, 2012.  This Standard provides basic principles, components, and design of telecommunications bonding and grounding that shall be followed to ensure that the telecommunication bonding and grounding systems within a building will have one electrical potential.

ANSI/TIA-607-Bwas published in January, 2013 and expands the content of TIA-607-B by summarizing the requirements for a structure’s electrical grounding electrode system and providing additional design and testing requirements for a telecommunications grounding electrode system.

ANSI/TIA-607-B-2 is currently under development and will provide additional requirements for a telecommunications bonding and grounding system when structural metal is used as the telecommunications bonding backbone instead of the telecommunications bonding backbone (TBB) or grounding equalizer (GE).  The expected publication date is 2014.

ANSI/TIA-607-B Content

RegulatoryOverview of Telecommunication Grounding and Bonding SystemsTelecommunications Grounding and Bonding ComponentsPerformance and Test RequirementsAnnexes addressing Grounding Electrodes, Towers and Antennas, Telecommunications Electrical Protection, Electrical Protection for Operator-Type Equipment Positions, and Cross Reference of Terms